SSD Thermal Pad 60×18 – 2Pcs (CoolerMaster)

180 EGP

Dimensions (L x W x H) 60 x 18 x 0.5mm
Substrate Material Copper Foil
Sputtering Material Graphite
Maximum Temperature 200 degrees celsius
Thermal Conductivity (X-Y) >900(W/mk)
Thermal Conductivity (Z) 120 (W/mk)

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Description

Dimensions (L x W x H) 60 x 18 x 0.5mm
Substrate Material Copper Foil
Sputtering Material Graphite
Maximum Temperature 200 degrees celsius
Thermal Conductivity (X-Y) >900(W/mk)
Thermal Conductivity (Z) 120 (W/mk)